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TSMC to build advanced packaging fab in northern Taiwan in 2020

TSMC's planned advanced packaging plant in Mi.....»»

Category: topSource: digitimesNov 14th, 2019

PTI advanced packaging draws new orders from Intel

Taiwan-based Powertech Technology (PTI) is working closely with Intel and will be engaged in the packaging services for the chip giant's upcoming QLC 3D NAND and heterogeneous chip solutions slated for launch in 2020, according to industry sources......»»

Category: topSource: digitimesOct 1st, 2019

TSMC may join forces with OSAT firms to build SoIC ecosystem

In the era of heterogeneous chips integration, Taiwan Semiconductor Manufacturing Company (TSMC) is expected be among global top-3 players in the advanced 3D .....»»

Category: topSource: digitimesSep 23rd, 2019

TSMC to see 7nm chip demand remain robust through 1H20

TSMC has enjoyed a pull-in of chip orders demanding advanced 7nm node manufacturing, with order visibility stretching through the first half of 2020, according to sources in Taiwan's IC design sector......»»

Category: topSource: digitimesSep 6th, 2019

TSMC to set up new fab for advanced packaging

Taiwan's Environmental Prote.....»»

Category: topSource: digitimesSep 26th, 2018

PTI to open new plant for panel-level packaging

Powertech Technology (PTI) has started constructing a new plant at the Hsinchu Science Park, northern Taiwan, which will enter volume production using the company's fan-out panel-level packaging (FOPLP) technology in 2020, according to the backend house......»»

Category: topSource: digitimesSep 26th, 2018

Prospects bright for silicon wafer suppliers, fab toolmakers

Taiwan-based silicon wafer suppliers and fab toolmakers, particularly those in the supply chain of TSMC, have enjoyed a ramp-up in orders recently and become optimistic about their sales outlook for 2020......»»

Category: topSource: digitimesDec 6th, 2019

UMC sees clear growth momentum for 5G in 2020

Taiwan's pure-play foundry UMC will see clear growth momentum in 2020 come from ever-increasing chips foundry demand for 5G applications, with clients moving actively to pull in shipments to build up inventory, according to company co-president SC Chien......»»

Category: topSource: digitimesDec 2nd, 2019

AOT to ship LED BLUs for 8K TVs in 3Q20

LED packaging service provider Advanced Optoelectronic Technology (AOT) will begin shipping LED backlight units (BLUs) for 8K LCD TVs in third-quarter 2020, according to the company......»»

Category: topSource: digitimesNov 27th, 2019

Wiwynn positive about 2020

Wiwynn, a cloud computing server affiliate of Wistron, is optimistic about its business outlook for 2020 with plans to build more production lines at is plant in southern Taiwan, according to company CTO Sunlai Chang......»»

Category: topSource: digitimesNov 19th, 2019

Laster to construct factory in Taiwan

Laster Tech will invest NT$450 million (US$14.8 million) to construct a factory for making smart LED automotive lighting modules in northern Taiwan with trial production scheduled for 2020......»»

Category: topSource: digitimesNov 15th, 2019

Highlights of the day: TSMC, UMC to increase fab capacity in China

TSMC has committed to building its most advanced fabs in Taiwan, but that doesn't mean that i.....»»

Category: topSource: digitimesNov 15th, 2019

TSMC board approves US$6.6 billion for advanced process capacity

The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of about US$6.62 billion for the construction o.....»»

Category: topSource: digitimesNov 13th, 2019

TSMC to accelerate 3nm fab construction

TSMC is expected to step up the construction of its advanced 3nm wafer fab after securing 30 hectares of land in the Southern Taiwan Science Park (STSP) by the end of 2019, according to industry sources......»»

Category: topSource: digitimesOct 24th, 2019

TSMC to get land for 3nm fab by year-end 2019

TSMC is expected to step up the construction of its advanced 3nm wafer fab after securing 30 hectares of land in the Southern Taiwan Science Park (STSP) by the end of 2019, according to industry sources......»»

Category: topSource: digitimesOct 24th, 2019

TSMC to volume produce 5nm chips as early as March 2020

TSMC is expected to move its more advanced 5nm process technology to volume production as early as March, according to industry sources......»»

Category: topSource: digitimesSep 23rd, 2019

Spirox expects partnership with National Instruments to bear fruit in 2020

Taiwan-based Spirox, a distributor of packaging and testing equipment, has formed a partnership with National Instruments (NI) and expects their cooperation to bear fruit in 2020......»»

Category: topSource: digitimesSep 12th, 2019

TSMC board approves US$6.5 billion for advanced process, capacity expansion

The board of Taiwan Semiconductor Man.....»»

Category: topSource: digitimesAug 14th, 2019

Advanced packaging to generate nearly US$3 billion in revenues in 2019, says TSMC chairman

Pure-play foundry TSMC remains aggressive in expanding its advanced packaging business, which will generate nearly US$3 billion in revenues this year, according to company chairman Mark Liu......»»

Category: topSource: digitimesMar 28th, 2019

TSMC develops SiP technology

Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology......»»

Category: topSource: digitimesJun 24th, 2018

TSMC board approves US$4.5 billion for capacity expansion

The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of approximately US$4.49 billion for new fabs construction, advanced-node and specialty technology upgrades and related capacity expansions......»»

Category: topSource: digitimesAug 15th, 2018